KENSTEL
About Brand:
Kenstel is a professionally managed company engaged in design and manufacture of Antennas, IBS, Connectors and Cable Assemblies and providing networking solutions. We are one of the largest manufacturers of these products in India. It all started in 1990 Our journey from 1990 to the present has been filled with milestones, challenges, and moments of triumph. The promoters of the company is a team of highly qualified engineers from IITs and other reputed engineering colleges with experience of more than 20 years. The company has excellent manufacturing and testing facilities and is supplying most of its production to reputed OEMs in the industry. We are an ISO 9001:2000 certified company. We are proud to announce that Kenstel is an ISO 9001:2000 certified company, a testament to our unwavering commitment to quality and excellence. This prestigious certification reflects our dedication to meeting and exceeding international standards in various aspects of our operations. Our Portfolio Our portfolio of wireless antenna systems include Sector Antennas, Grid Parabolic Antennas, Omni Directional Antennas, Patch Panel Antennas, Ground Plane Antennas, Yagi Antennas, Collinear Antennas, Mobile Antennas, Train Antennas, Marine Antennas, WiFi, WiLAN, WiMAX, GSM and CDMA Antennas, IBS (IN Building Solutions), RF Connectors, RF Components such as power splitters and cable assemblies. Our vision is simple. At Kenstel, we envision a future where connectivity knows no bounds, where information flows effortlessly, and where people and organizations can thrive through seamless networking solutions. Our vision is to be at the forefront of this transformation, pioneering cutting-edge technology to make it a reality. Surface Mount Technology (SMT) Assembly Our SMT Assembly process is a finely tuned orchestration of cutting-edge technology and skilled craftsmanship. It involves the placement of electronic components directly onto the surface of printed circuit boards (PCBs), leading to compact, reliable, and high-performance networking devices. Upto 126000 CPH placement capability Wide component range from 0.2mm*0.1mm to 74mm x 74mm /50mm x 150mm Board size upto 950*370 mm Ability to place BGA , uBGA POP and Flip Chip Components Placement accuracy upto 20 um Upto 224 feeders and 30 Trays
Company Documents:
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